MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning1. Environmentally friendly material, lead free and halogen free, less smoke and less odor 2. Bright solder joints, no resistance, non conductive 3. Less residue, less smoke, good flow performance 4. No short circuit, no need to clean, infinite conductivity 5. Scope of use: BGA dense pin IC mobile phone motherboard computer motherboard high precision welding, etc. 6. Weight: about 20g 7. Size: about 12. 7 x 2. 9cm Specification: Package Weight One