Quality Conformance and Qualification of Microelectronic Packages and InterconnectsAll packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL STDs and other government standards and testprocedures that don't cost effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure